发明授权
US08796129B2 Nonvolatile storage device and method for manufacturing the same in which insulating film is located between first and second impurity diffusion regions but absent on first impurity diffusion region 有权
非易失性存储装置及其制造方法,其中绝缘膜位于第一和第二杂质扩散区之间但在第一杂质扩散区上不存在

  • 专利标题: Nonvolatile storage device and method for manufacturing the same in which insulating film is located between first and second impurity diffusion regions but absent on first impurity diffusion region
  • 专利标题(中): 非易失性存储装置及其制造方法,其中绝缘膜位于第一和第二杂质扩散区之间但在第一杂质扩散区上不存在
  • 申请号: US13688903
    申请日: 2012-11-29
  • 公开(公告)号: US08796129B2
    公开(公告)日: 2014-08-05
  • 发明人: Yukihide Tsuji
  • 申请人: Nec Corporation
  • 申请人地址: JP Tokyo
  • 专利权人: NEC Corporation
  • 当前专利权人: NEC Corporation
  • 当前专利权人地址: JP Tokyo
  • 代理机构: Sughrue Mion, PLLC
  • 优先权: JP2006-338196 20061215
  • 主分类号: H01L21/3205
  • IPC分类号: H01L21/3205 H01L21/4763 H01L29/40 H01L21/28 H01L27/115 H01L29/423 H01L29/66 H01L29/792
Nonvolatile storage device and method for manufacturing the same in which insulating film is located between first and second impurity diffusion regions but absent on first impurity diffusion region
摘要:
Provided is an excellent nonvolatile storage device having advantageous in miniaturization and less variation in initial threshold value, and exhibiting a high writing efficiency, without an erasing failure and a retention failure. The nonvolatile storage device is characterized by including a film stack extending from between a semiconductor substrate and a gate electrode onto at least a surface of the gate electrode lying on a first impurity diffusion region side, the film stack including a charge accumulating layer and a tunnel insulating film sequentially from a gate electrode side.
信息查询
IPC分类:
H 电学
H01 基本电气元件
H01L 半导体器件;其他类目中不包括的电固体器件(使用半导体器件的测量入G01;一般电阻器入H01C;磁体、电感器、变压器入H01F;一般电容器入H01G;电解型器件入H01G9/00;电池组、蓄电池入H01M;波导管、谐振器或波导型线路入H01P;线路连接器、汇流器入H01R;受激发射器件入H01S;机电谐振器入H03H;扬声器、送话器、留声机拾音器或类似的声机电传感器入H04R;一般电光源入H05B;印刷电路、混合电路、电设备的外壳或结构零部件、电气元件的组件的制造入H05K;在具有特殊应用的电路中使用的半导体器件见应用相关的小类)
H01L21/00 专门适用于制造或处理半导体或固体器件或其部件的方法或设备
H01L21/02 .半导体器件或其部件的制造或处理
H01L21/04 ..至少具有一个跃变势垒或表面势垒的器件,例如PN结、耗尽层、载体集结层
H01L21/18 ...器件有由周期表Ⅳ族元素或含有/不含有杂质的AⅢBⅤ族化合物构成的半导体,如掺杂材料
H01L21/30 ....用H01L21/20至H01L21/26各组不包含的方法或设备处理半导体材料的(在半导体材料上制作电极的入H01L21/28)
H01L21/31 .....在半导体材料上形成绝缘层的,例如用于掩膜的或应用光刻技术的(密封层入H01L21/56);以及这些层的后处理;这些层的材料的选择
H01L21/3205 ......非绝缘层的沉积,例如绝缘层上的导电层或电阻层;这些层的后处理(电极的制造入H01L21/28)
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