发明授权
US08796132B2 System and method for forming uniform rigid interconnect structures
有权
用于形成均匀刚性互连结构的系统和方法
- 专利标题: System and method for forming uniform rigid interconnect structures
- 专利标题(中): 用于形成均匀刚性互连结构的系统和方法
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申请号: US13539188申请日: 2012-06-29
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公开(公告)号: US08796132B2公开(公告)日: 2014-08-05
- 发明人: Ming-Chung Sung , Yung Ching Chen , Chien-Hsun Lee , Chen-Hua Yu , Mirng-Ji Lii
- 申请人: Ming-Chung Sung , Yung Ching Chen , Chien-Hsun Lee , Chen-Hua Yu , Mirng-Ji Lii
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 代理机构: Slater and Matsil, L.L.P.
- 主分类号: H01L21/60
- IPC分类号: H01L21/60 ; H01L21/48
摘要:
Disclosed herein is a system and method for mounting semiconductor packages by forming one or more interconnects, optionally, with a wirebonder, and mounting the interconnects to a mounting pad on a target package. Mounting the interconnect may comprise ultrasonically welding the interconnects to the mounting pads, and the interconnect may be mounted via a mounting node on the end of the interconnect, wherein the mounting node may be formed by an electric flame off process. The interconnects may be trimmed to one or more substantially uniform heights, optionally using a laser or contact-type trimming system, and the tails of the interconnects may be supported during trimming. A top package may be bonded on the trimmed ends of the interconnects. During mounting, a support plate may be used to support the package, and a mask maybe used during interconnect mounting.