Invention Grant
- Patent Title: Embedded wafer level ball grid array bar systems and methods
- Patent Title (中): 嵌入式晶圆级球栅阵列系统及方法
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Application No.: US13722776Application Date: 2012-12-20
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Publication No.: US08796139B2Publication Date: 2014-08-05
- Inventor: Anandan Ramasamy , Yonggang Jin , Yun Liu
- Applicant: STMicroelectronics Pte Ltd.
- Applicant Address: SG Singapore
- Assignee: STMicroelectronics Pte Ltd
- Current Assignee: STMicroelectronics Pte Ltd
- Current Assignee Address: SG Singapore
- Agency: Seed IP Law Group PLLC
- Main IPC: H01L21/44
- IPC: H01L21/44
Abstract:
A bar formed from a reconstituted wafer and containing one or more conductive material filled voids is used to electrically and physically connect the top and bottom packages in a package-on-package (PoP) package. The bar is disposed in the fan out area of the lower package forming the PoP package.
Public/Granted literature
- US20130168858A1 EMBEDDED WAFER LEVEL BALL GRID ARRAY BAR SYSTEMS AND METHODS Public/Granted day:2013-07-04
Information query
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