Invention Grant
- Patent Title: Method for controlling electrical property of passive device during fabrication of integrated component and related integrated component
- Patent Title (中): 用于控制无源器件集成元件及相关集成元件制造过程中电性能的方法
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Application No.: US13797992Application Date: 2013-03-12
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Publication No.: US08796813B2Publication Date: 2014-08-05
- Inventor: Ming-Da Tsai , George Chien , Cheng-Chou Hung
- Applicant: Mediatek Inc.
- Applicant Address: TW Science-Based Industrial Park, Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Science-Based Industrial Park, Hsin-Chu
- Agent Winston Hsu; Scott Margo
- Main IPC: H01L21/71
- IPC: H01L21/71 ; H01L27/02
Abstract:
A method for controlling an electrical property of a passive device during a fabrication of an integrated component includes providing a substrate, manufacturing the passive device on the substrate, measuring the electrical property of the passive device to obtain a measuring result, determining at least one layout pattern corresponding to at least one later manufacturing process by the measuring result for adjusting the electrical property of the passive device, and continuing the rest of the fabrication including the at least one later manufacturing process of the integrated component.
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Information query
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