- 专利标题： Solder bump for ball grid array
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申请号： US13572302申请日： 2012-08-10
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公开(公告)号： US08796833B2公开(公告)日： 2014-08-05
- 发明人: Jung-Hua Chang , Cheng-Lin Huang , Jing-Cheng Lin
- 申请人： Jung-Hua Chang , Cheng-Lin Huang , Jing-Cheng Lin
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater and Matsil, L.L.P.
- 主分类号： H01L23/495
- IPC分类号： H01L23/495
摘要：
A solder bump structure for a ball grid array (BGA) includes at least one under bump metal (UBM) layer and a solder bump formed over the at least one UBM layer. The solder bump has a bump width and a bump height and the ratio of the bump height over the bump width is less than 1.
公开/授权文献
- US09159687B2 Solder bump for ball grid array 公开/授权日：2015-10-13
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