Invention Grant
US08797121B2 Distributed coupler with first line on substrate and second line in package supporting substrate
有权
分布式耦合器，第一线在衬底和第二线在封装支撑衬底
- Patent Title: Distributed coupler with first line on substrate and second line in package supporting substrate
- Patent Title (中): 分布式耦合器，第一线在衬底和第二线在封装支撑衬底
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Application No.: US13228178Application Date: 2011-09-08
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Publication No.: US08797121B2Publication Date: 2014-08-05
- Inventor: Hilal Ezzeddine , Claire Laporte
- Applicant: Hilal Ezzeddine , Claire Laporte
- Applicant Address: FR Tours
- Assignee: STMicroelectronics (Tours) SAS
- Current Assignee: STMicroelectronics (Tours) SAS
- Current Assignee Address: FR Tours
- Agency: Wolf, Greenfield & Sacks, P.C.
- Priority: FR1057191 20100910
- Main IPC: H01P5/12
- IPC: H01P5/12 ; H01P3/08
Abstract:
A distributed coupler including a first line intended to convey a radio signal between its two ends and a second line intended to sample, by coupling, part of the signal, wherein: one of the lines is formed on an insulating substrate; and the other line is formed in a lead frame supporting the substrate, one line being above the other.
Public/Granted literature
- US20120062333A1 PACKAGED COUPLER Public/Granted day:2012-03-15
Information query
