Two or more outer-layer dummy conductors are successively arranged at predetermined intervals in the height direction, thereby forming a plurality of outer-layer dummy groups. Given that an interval between the adjacent outer-layer dummy conductors within each of the outer-layer dummy groups is d and an interval between the adjacent outer-layer dummy groups is g, g is greater than d. On that condition, the outer-layer dummy groups can be positioned satisfactorily apart away from each other, while plating deposition points are ensured. As a result, pressing of inner electrodes through the outer-layer dummy conductors can be relieved, whereby the distance between the inner electrodes can be prevented from being locally shortened and a reduction of BDV can be prevented.