Invention Grant
- Patent Title: Clamshell packaging
- Patent Title (中): 蛤壳式包装
-
Application No.: US13907270Application Date: 2013-05-31
-
Publication No.: US08800768B2Publication Date: 2014-08-12
- Inventor: Jeffrey Corbat , Wai Tat Choi
- Applicant: Milwaukee Electric Tool Corporation
- Applicant Address: US WI Brookfield
- Assignee: Milwaukee Electric Tool Corporation
- Current Assignee: Milwaukee Electric Tool Corporation
- Current Assignee Address: US WI Brookfield
- Agency: Michael Best & Friedrich LLP
- Main IPC: B65D75/32
- IPC: B65D75/32 ; B65D73/00

Abstract:
A clamshell package includes a first clamshell portion having a first surface with a first edge, and a first chamber portion. A second clamshell portion is coupled to the first clamshell portion about a fold axis. The second clamshell portion has a second surface with a second edge, and a second chamber portion. A paper card includes a first card portion, a second card portion, and a connecting portion connecting the first card portion and the second card portion. The first card portion is coupled to the first surface. The second portion is coupled to the second surface. The first edge and second edge extend beyond a perimeter of the paper card. A hanging hole extends through the first clamshell portion, the second clamshell portion, and the paper card.
Public/Granted literature
- US20130319896A1 CLAMSHELL PACKAGING Public/Granted day:2013-12-05
Information query
IPC分类: