Invention Grant
- Patent Title: Clamping device
- Patent Title (中): 夹紧装置
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Application No.: US13579411Application Date: 2011-02-15
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Publication No.: US08800982B2Publication Date: 2014-08-12
- Inventor: Takayuki Kawakami
- Applicant: Takayuki Kawakami
- Applicant Address: JP Hyogo
- Assignee: Pascal Engineering Corporation
- Current Assignee: Pascal Engineering Corporation
- Current Assignee Address: JP Hyogo
- Agency: Jordan and Hamburg LLP
- Priority: JP2010-044126 20100301; JP2010-141560 20100622
- International Application: PCT/JP2011/053131 WO 20110215
- International Announcement: WO2011/108352 WO 20110909
- Main IPC: B23Q3/00
- IPC: B23Q3/00 ; B23Q1/00 ; B23Q3/06

Abstract:
A clamping device increases the diameter of a gripping assembly that is inserted into a hole in a workpiece and thus grips the inner circumferential surface of the hole, and particularly relates to such a clamping device that is adapted so that, in the vicinity of a scraper, no clearance occurs between the gripping assembly and a clamp rod, and the scraper. The clamping device is capable of enhancing the durability of a scraper, reducing the amount of pressurized air consumed by blowing, and ensuring the strength of a clamp rod against pulling and so on.
Public/Granted literature
- US20120319340A1 CLAMPING DEVICE Public/Granted day:2012-12-20
Information query
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