Invention Grant
US08801505B2 Abrading device and method of abrading a floor structure utilizing the same 有权
研磨装置和利用其研磨地板结构的方法

  • Patent Title: Abrading device and method of abrading a floor structure utilizing the same
  • Patent Title (中): 研磨装置和利用其研磨地板结构的方法
  • Application No.: US12825448
    Application Date: 2010-06-29
  • Publication No.: US08801505B2
    Publication Date: 2014-08-12
  • Inventor: W. Steven Smith
  • Applicant: W. Steven Smith
  • Applicant Address: US DE Wilmington
  • Assignee: AWI Licensing Company
  • Current Assignee: AWI Licensing Company
  • Current Assignee Address: US DE Wilmington
  • Agent Amy M. Fernandez
  • Main IPC: B24B21/12
  • IPC: B24B21/12
Abrading device and method of abrading a floor structure utilizing the same
Abstract:
An abrading device for abrading a floor structure comprises a first abrading assembly and a second abrading assembly. The first and second abrading assemblies each have a rotationally driven contact roll provided with a sleeve having a plurality of cutouts formed in a pattern thereon. An abrading belt is trained over the sleeve. A first oscillation assembly is connected to the first abrading assembly and oscillates the contact roll of the first abrading assembly in a first direction via a linear reciprocating motion. A second oscillation assembly is connected to the second abrading assembly and oscillates the contact roll of the second abrading assembly in a second direction via a linear reciprocating motion. The first and second abrading assemblies consecutively abrade a top surface of the floor structure with the pattern formed by the cutouts on the respective sleeves to form a distressed visible pattern thereon.
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