Invention Grant
- Patent Title: Abrading device and method of abrading a floor structure utilizing the same
- Patent Title (中): 研磨装置和利用其研磨地板结构的方法
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Application No.: US12825448Application Date: 2010-06-29
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Publication No.: US08801505B2Publication Date: 2014-08-12
- Inventor: W. Steven Smith
- Applicant: W. Steven Smith
- Applicant Address: US DE Wilmington
- Assignee: AWI Licensing Company
- Current Assignee: AWI Licensing Company
- Current Assignee Address: US DE Wilmington
- Agent Amy M. Fernandez
- Main IPC: B24B21/12
- IPC: B24B21/12

Abstract:
An abrading device for abrading a floor structure comprises a first abrading assembly and a second abrading assembly. The first and second abrading assemblies each have a rotationally driven contact roll provided with a sleeve having a plurality of cutouts formed in a pattern thereon. An abrading belt is trained over the sleeve. A first oscillation assembly is connected to the first abrading assembly and oscillates the contact roll of the first abrading assembly in a first direction via a linear reciprocating motion. A second oscillation assembly is connected to the second abrading assembly and oscillates the contact roll of the second abrading assembly in a second direction via a linear reciprocating motion. The first and second abrading assemblies consecutively abrade a top surface of the floor structure with the pattern formed by the cutouts on the respective sleeves to form a distressed visible pattern thereon.
Public/Granted literature
- US20110318993A1 Abrading device and method of abrading a floor structure utilizing the same Public/Granted day:2011-12-29
Information query