发明授权
- 专利标题： Microplates with ultra-thin walls by two-stage forming
- 专利标题（中）： 具有超薄壁的微孔板通过两段成型
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申请号： US12511839申请日： 2009-07-29
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公开(公告)号： US08802000B2公开(公告)日： 2014-08-12
- 发明人: Daniel Y. Chu , Hui Du
- 申请人： Daniel Y. Chu , Hui Du
- 申请人地址： US CA Hercules
- 专利权人： Bio-Rad Laboratories, Inc.
- 当前专利权人： Bio-Rad Laboratories, Inc.
- 当前专利权人地址： US CA Hercules
- 代理机构： Kilpatrick Townsend & Stockton LLP
- 主分类号： B29C51/10
- IPC分类号： B29C51/10 ; B29C51/04 ; B01L3/00 ; B29C51/02 ; B29K23/00
摘要：
A multi-well plate with wells having ultra-thin walls and yet with sufficient structural rigidity to allow reliable use of the plate in automated instrumentation is formed by first forming a plate blank by injection molding, the blank being of a thickness that provides the desired rigidity, and then subjecting the blank to vacuum forming to stretch designated areas in the blank to form wells or to extend wells already formed, the stretching resulting in a reduction in thickness of the molded resin at the walls of the wells only.
公开/授权文献
- US20100028988A1 Microplates with Ultra-Thin Walls by Two-Stage Forming 公开/授权日：2010-02-04
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