发明授权
- 专利标题： Pressure sensor and method of packaging same
- 专利标题（中）： 压力传感器及其包装方法
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申请号： US14219011申请日： 2014-03-19
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公开(公告)号： US08802474B1公开(公告)日： 2014-08-12
- 发明人: Jinzhong Yao , Wai Yew Lo , Lan Chu Tan , Xuesong Xu
- 申请人： Jinzhong Yao , Wai Yew Lo , Lan Chu Tan , Xuesong Xu
- 申请人地址： US TX Austin
- 专利权人： Freescale Semiconductor, Inc.
- 当前专利权人： Freescale Semiconductor, Inc.
- 当前专利权人地址： US TX Austin
- 代理商 Charles Bergere
- 主分类号： H01L21/00
- IPC分类号： H01L21/00 ; H01L29/84 ; H01L41/25
摘要：
A method of packaging a pressure sensor die includes providing a lead frame having a die pad and lead fingers that surround the die pad. A tape is attached to a first side of the lead frame. A pressure sensor die is attached to the die pad on a second side of the lead frame and bond pads of the die are connected to the lead fingers. An encapsulant is dispensed onto the second side of the lead frame and covers the lead fingers and the electrical connections thereto. A gel is dispensed onto a top surface of the die and covers the die bond pads and the electrical connections thereto. A lid is attached to the lead frame and covers the die and the gel, and sides of the lid penetrate the encapsulant.
公开/授权文献
- US20140206124A1 PRESSURE SENSOR AND METHOD OF PACKAGING SAME 公开/授权日：2014-07-24
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