发明授权
- 专利标题： Method of manufacturing a semiconductor device and a semiconductor device produced thereby
- 专利标题（中）： 制造半导体器件的方法和由此制造的半导体器件
-
申请号： US12280248申请日： 2007-02-14
-
公开(公告)号： US08802506B2公开(公告)日： 2014-08-12
- 发明人: Minoru Isshiki , Tomoko Kato , Yoshitsugu Morita , Hiroshi Ueki
- 申请人： Minoru Isshiki , Tomoko Kato , Yoshitsugu Morita , Hiroshi Ueki
- 申请人地址： JP Chiyoda-Ku, Tokyo
- 专利权人： Dow Corning Toray Company, Ltd.
- 当前专利权人： Dow Corning Toray Company, Ltd.
- 当前专利权人地址： JP Chiyoda-Ku, Tokyo
- 代理机构： Howard & Howard Attorneys PLLC
- 优先权： JP2006-046872 20060223
- 国际申请： PCT/JP2007/053131 WO 20070214
- 国际公布： WO2007/099823 WO 20070907
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
A method of manufacturing a semiconductor device sealed in a cured silicone body by placing an unsealed semiconductor device into a mold and subjecting a curable silicone composition which is fed into the space between the mold and the unsealed semiconductor device to compression molding, the method being characterized by the fact that the aforementioned curable silicone composition comprises at least the following components: (A) an epoxy-containing silicone and (B) a curing agent for an epoxy resin; can reduce warping of the semiconductor chips and circuit board, and improve surface resistance to scratching.