Invention Grant
- Patent Title: Removing and segregating components from printed circuit boards
- Patent Title (中): 从印刷电路板上清除和分离组件
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Application No.: US13729508Application Date: 2012-12-28
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Publication No.: US08807189B2Publication Date: 2014-08-19
- Inventor: Mark Meloni
- Applicant: Empire Technology Development LLC
- Applicant Address: US DE Wilmington
- Assignee: Empire Technology Development LLC
- Current Assignee: Empire Technology Development LLC
- Current Assignee Address: US DE Wilmington
- Agency: Turk IP Law, LLC
- Main IPC: B32B38/10
- IPC: B32B38/10

Abstract:
Implementations and techniques for removing and segregating components from printed circuit boards are generally disclosed.
Public/Granted literature
- US20130125364A1 REMOVING AND SEGREGATING COMPONENTS FROM PRINTED CIRCUIT BOARDS Public/Granted day:2013-05-23
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