Invention Grant
- Patent Title: Method of joining superconductor materials
- Patent Title (中): 超导材料接合方法
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Application No.: US13490429Application Date: 2012-06-06
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Publication No.: US08808492B2Publication Date: 2014-08-19
- Inventor: Kun-Ping Huang , Chih-Chen Chang , Yu-Tse Hsieh , Chih-Wei Luo , Chih-Hsiang Su , Wen-Yen Tzeng
- Applicant: Kun-Ping Huang , Chih-Chen Chang , Yu-Tse Hsieh , Chih-Wei Luo , Chih-Hsiang Su , Wen-Yen Tzeng
- Applicant Address: TW Hsinchu
- Assignee: Industrial Technology Research Institute
- Current Assignee: Industrial Technology Research Institute
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW100147425A 20111220
- Main IPC: H01L39/24
- IPC: H01L39/24

Abstract:
A method of joining superconductor materials is described. A microwave chamber including a first heat absorption plate and a second heat absorption plate corresponding to the first absorption plate is provided. A first superconductor material and a second superconductor material are disposed between the first heat absorption plate and the second heat absorption plate in the microwave chamber. The first superconductor material and the second superconductor material have an overlapping region therebetween, and a pressure is applied to the first heat absorption plate and the second heat absorption plate. Microwave power is supplied to the microwave chamber. The first heat absorption plate and the second heat absorption plate transform the microwave power into thermal energy so as to join the first superconductor material and the second superconductor material at the overlapping region.
Public/Granted literature
- US20130157868A1 METHOD OF JOINING SUPERCONDUCTOR MATERIALS Public/Granted day:2013-06-20
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