Invention Grant
- Patent Title: Low-melting-point glass composition and conductive paste material using same
- Patent Title (中): 低熔点玻璃组合物和导电糊料使用相同
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Application No.: US13634727Application Date: 2011-06-14
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Publication No.: US08808582B2Publication Date: 2014-08-19
- Inventor: Jun Hamada
- Applicant: Jun Hamada
- Applicant Address: JP Ube-shi
- Assignee: Central Glass Company, Limited
- Current Assignee: Central Glass Company, Limited
- Current Assignee Address: JP Ube-shi
- Agency: Crowell and Moring LLP
- Priority: JP2010-147806 20100629
- International Application: PCT/JP2011/063590 WO 20110614
- International Announcement: WO2012/002143 WO 20120105
- Main IPC: H01B1/16
- IPC: H01B1/16 ; C03C8/18
Abstract:
A conductive paste material containing a SiO2-B2O3—ZnO—RO—R2O type lead-free low-melting-point glass that contains, by wt %, 2 to 10% of SiO2, 18 to 30% of B2O3, 0 to 10% of Al2O3, 0 to 25% of ZnO, 20-50% of RO where RO represents one or more of MgO, CaO, SrO, and BaO, and 10 to 17% of R2O where R2O represents one or more of Li2O, Na2O, and K2O.
Public/Granted literature
- US20130119326A1 Low-Melting-Point Glass Composition and Conductive Paste Material Using Same Public/Granted day:2013-05-16
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