发明授权
- 专利标题： Packaging process tools and packaging methods for semiconductor devices
- 专利标题（中）： 半导体器件的封装工艺和封装方法
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申请号： US13270890申请日： 2011-10-11
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公开(公告)号： US08809117B2公开(公告)日： 2014-08-19
- 发明人: Wen-Hsiung Lu , Ming-Da Cheng , Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Chung-Shi Liu
- 申请人： Wen-Hsiung Lu , Ming-Da Cheng , Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chun-Cheng Lin , Chung-Shi Liu
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwain Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwain Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater and Matsil, L.L.P.
- 主分类号： H01L21/00
- IPC分类号： H01L21/00
摘要：
Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region.
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