发明授权
- 专利标题: Capping layers for metal oxynitride TFTs
- 专利标题(中): 金属氮氧化物TFT的封盖层
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申请号: US13215013申请日: 2011-08-22
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公开(公告)号: US08809132B2公开(公告)日: 2014-08-19
- 发明人: Yan Ye
- 申请人: Yan Ye
- 申请人地址: US CA Santa Clara
- 专利权人: Applied Materials, Inc.
- 当前专利权人: Applied Materials, Inc.
- 当前专利权人地址: US CA Santa Clara
- 代理机构: Patterson & Sheridan, LLP
- 主分类号: H01L21/00
- IPC分类号: H01L21/00 ; H01L21/84 ; H01L29/786 ; H01L21/02
摘要:
A capping layer may be deposited over the active channel of a thin film transistor (TFT) in order to protect the active channel from contamination. The capping layer may affect the performance of the TFT. If the capping layer contains too much hydrogen, nitrogen, or oxygen, the threshold voltage, sub threshold slope, and mobility of the TFT may be negatively impacted. By controlling the ratio of the flow rates of the nitrogen, oxygen, and hydrogen containing gases, the performance of the TFT may be optimized. Additionally, the power density, capping layer deposition pressure, and the temperature may also be controlled to optimize the TFT performance.
公开/授权文献
- US20110306169A1 CAPPING LAYERS FOR METAL OXYNITRIDE TFTS 公开/授权日:2011-12-15
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