Invention Grant
US08809140B2 Aqua regia and hydrogen peroxide HCl combination to remove Ni and NiPt residues
有权
水王和过氧化氢HCl组合去除Ni和NiPt残留物
- Patent Title: Aqua regia and hydrogen peroxide HCl combination to remove Ni and NiPt residues
- Patent Title (中): 水王和过氧化氢HCl组合去除Ni和NiPt残留物
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Application No.: US13953446Application Date: 2013-07-29
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Publication No.: US08809140B2Publication Date: 2014-08-19
- Inventor: Anh Duong , Clemens Fitz , Olov Karlsson
- Applicant: Intermolecular Inc. , GLOBALFOUNDRIES, Inc.
- Applicant Address: US CA San Jose KY Grand Cayman
- Assignee: Intermolecular, Inc.,GLOBALFOUNDRIES, Inc.
- Current Assignee: Intermolecular, Inc.,GLOBALFOUNDRIES, Inc.
- Current Assignee Address: US CA San Jose KY Grand Cayman
- Main IPC: H01L21/336
- IPC: H01L21/336
Abstract:
A method for cleaning residues from a semiconductor substrate during a nickel platinum silicidation process is disclosed, including a multi-step residue cleaning, including exposing the substrate to an aqua regia solution, followed by an exposure to a solution having hydrochloric acid and hydrogen peroxide. The SC2 solution can further react with remaining platinum residues, rendering it more soluble in an aqueous solution and thereby dissolving it from the surface of the substrate.
Public/Granted literature
- US20130323890A1 Aqua Regia and Hydrogen Peroxide HCl Combination to Remove Ni and NiPt Residues Public/Granted day:2013-12-05
Information query
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