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US08809146B2 Semiconductor devices comprising a plurality of gate structures 有权
包括多个栅极结构的半导体器件

Semiconductor devices comprising a plurality of gate structures
Abstract:
Methods for forming semiconductor memory structures including a gap between adjacent gate structures are provided. The methods may include forming an insulation layer between the adjacent gate structures. In some embodiments, the methods may include subsequently removing a portion of the insulation layer to leave the gap between the adjacent gate structures.
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