Invention Grant
- Patent Title: Radiation enhanced resistive switching layers
- Patent Title (中): 辐射增强电阻开关层
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Application No.: US13722155Application Date: 2012-12-20
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Publication No.: US08809159B2Publication Date: 2014-08-19
- Inventor: Yun Wang , Tony P. Chiang , Tim Minvielle , Takeshi Yamaguchi
- Applicant: Intermolecular Inc. , Kabushiki Kaisha Toshiba , SanDisk 3D LLC
- Applicant Address: US CA San Jose JP Tokyo US CA Milpitas
- Assignee: Intermolecular, Inc.,Kabushiki Kaisha Toshiba,SanDisk 3D LLC
- Current Assignee: Intermolecular, Inc.,Kabushiki Kaisha Toshiba,SanDisk 3D LLC
- Current Assignee Address: US CA San Jose JP Tokyo US CA Milpitas
- Main IPC: H01L21/20
- IPC: H01L21/20

Abstract:
Provided are radiation enhanced resistive switching layers, resistive random access memory (ReRAM) cells including these layers, as well as methods of forming these layers and cells. Radiation creates defects in resistive switching materials that allow forming and breaking conductive paths in these materials thereby improving their resistive switching characteristics. For example, ionizing radiation may break chemical bonds in various materials used for such a layer, while non-ionizing radiation may form electronic traps. Radiation power, dozing, and other processing characteristics can be controlled to generate a distribution of defects within the resistive switching layer. For example, an uneven distribution of defects through the thickness of a layer may help with lowering switching voltages and/or currents. Radiation may be performed before or after thermal annealing, which may be used to control distribution of radiation created defects and other types of defects in resistive switching layers.
Public/Granted literature
- US20140175364A1 RADIATION ENHANCED RESISTIVE SWITCHING LAYERS Public/Granted day:2014-06-26
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