发明授权
US08809691B2 Wired circuit board having first and second conductive patterns with respective connecting portions formed on first and second insulating layers
有权
有线电路板，具有形成在第一和第二绝缘层上的具有相应连接部分的第一和第二导电图案
- 专利标题： Wired circuit board having first and second conductive patterns with respective connecting portions formed on first and second insulating layers
- 专利标题（中）： 有线电路板，具有形成在第一和第二绝缘层上的具有相应连接部分的第一和第二导电图案
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申请号： US13554799申请日： 2012-07-20
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公开(公告)号： US08809691B2公开(公告)日： 2014-08-19
- 发明人: Tetsuya Ohsawa
- 申请人： Tetsuya Ohsawa
- 申请人地址： JP Osaka
- 专利权人： Nitto Denko Corporation
- 当前专利权人： Nitto Denko Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： Edwards Neils PLLC
- 代理商 Jean C. Edwards
- 优先权： JP2011-159688 20110721; JP2011-180971 20110822
- 主分类号： H05K1/03
- IPC分类号： H05K1/03 ; G11B5/48 ; H05K1/05
摘要：
A wired circuit board includes an insulating layer, and a conductive layer formed on the insulating layer. The insulating layer includes a first insulating layer, and a second insulating layer formed on the first insulating layer. The conductive layer includes a first conductive pattern, and a second conductive pattern. The first conductive pattern includes a first connecting portion formed on the first insulating layer and under the second insulating layer, and at least one pair of first terminals configured continuously to the first connecting portion so as to electrically connect to an external electronic element and spaced apart from each other to allow the electronic element to extend therebetween. The second conductive pattern includes a second connecting portion formed on the second insulating layer, and a second terminal configured continuously to the second connecting portion so as to electrically connect to a magnetic head provided on an external slider.
公开/授权文献
- US20130020112A1 WIRED CIRCUIT BOARD 公开/授权日：2013-01-24
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