发明授权
- 专利标题： Semiconductor device having a pad and plurality of interconnects
- 专利标题（中）： 具有焊盘和多个互连的半导体器件
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申请号： US13323454申请日： 2011-12-12
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公开(公告)号： US08810039B2公开(公告)日： 2014-08-19
- 发明人: Koji Takemura , Hiroshige Hirano , Masao Takahashi , Hikari Sano , Yutaka Itoh , Koji Koike
- 申请人： Koji Takemura , Hiroshige Hirano , Masao Takahashi , Hikari Sano , Yutaka Itoh , Koji Koike
- 申请人地址： JP Osaka
- 专利权人： Panasonic Corporation
- 当前专利权人： Panasonic Corporation
- 当前专利权人地址： JP Osaka
- 代理机构： McDermott Will & Emery LLP
- 优先权： JP2005-254852 20050902
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L23/00 ; H01L21/66
摘要：
A semiconductor device includes: a semiconductor substrate; a first interlayer insulating film formed over the semiconductor substrate; a pad formed above the first interlayer insulating film; and a plurality of first interconnects spaced apart from each other in a portion of the first interlayer insulating film located below the pad. Below the pad, the first interconnects are formed in quadrangular plan shapes.
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