发明授权
US08812773B2 Method of merging blocks in a semiconductor memory device, and semiconductor memory device to perform a method of merging blocks 有权
在半导体存储器件中合并块的方法以及半导体存储器件来执行合并块的方法

  • 专利标题: Method of merging blocks in a semiconductor memory device, and semiconductor memory device to perform a method of merging blocks
  • 专利标题(中): 在半导体存储器件中合并块的方法以及半导体存储器件来执行合并块的方法
  • 申请号: US13114262
    申请日: 2011-05-24
  • 公开(公告)号: US08812773B2
    公开(公告)日: 2014-08-19
  • 发明人: Min-Seok KimKi-Tae Park
  • 申请人: Min-Seok KimKi-Tae Park
  • 申请人地址: KR Suwon-si
  • 专利权人: SAMSUNG Electronics Co., Ltd.
  • 当前专利权人: SAMSUNG Electronics Co., Ltd.
  • 当前专利权人地址: KR Suwon-si
  • 代理机构: Stanzione & Kim, LLP
  • 优先权: KR10-2010-0048367 20100525
  • 主分类号: G06F12/00
  • IPC分类号: G06F12/00
Method of merging blocks in a semiconductor memory device, and semiconductor memory device to perform a method of merging blocks
摘要:
In a method of merging blocks in a semiconductor memory device according to example embodiments, a plurality of data are written into one or more first blocks using a first program method. One or more merge target blocks that are required to be merged are selected among the one or more first blocks. A merge-performing block for a block merge operation is selected among the one or more first blocks and one or more second blocks. A plurality of merge target data are written from the merge target blocks into the merge-performing block using a second program method that is different from the first program method.
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