发明授权
- 专利标题: Metal laminated substrate for use as an oxide superconducting wire material, and manufacturing method therefor
- 专利标题(中): 用作氧化物超导线材的金属层压基板及其制造方法
-
申请号: US13383957申请日: 2010-07-08
-
公开(公告)号: US08815777B2公开(公告)日: 2014-08-26
- 发明人: Hironao Okayama , Teppei Kurokawa , Kouji Nanbu , Yoshihiko Isobe , Takashi Koshiro , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuya Ohmastu
- 申请人: Hironao Okayama , Teppei Kurokawa , Kouji Nanbu , Yoshihiko Isobe , Takashi Koshiro , Akira Kaneko , Hajime Ota , Kotaro Ohki , Takashi Yamaguchi , Kazuya Ohmastu
- 申请人地址: JP Tokyo JP Osaka
- 专利权人: Toyo Kohan Co., Ltd.,Sumitomo Electric Industries, Ltd.
- 当前专利权人: Toyo Kohan Co., Ltd.,Sumitomo Electric Industries, Ltd.
- 当前专利权人地址: JP Tokyo JP Osaka
- 代理机构: Browdy and Neimark, PLLC
- 优先权: JP2009-169531 20090717
- 国际申请: PCT/JP2010/004460 WO 20100708
- 国际公布: WO2011/007527 WO 20110120
- 主分类号: H01L39/24
- IPC分类号: H01L39/24
摘要:
A metal laminated substrate for an oxide superconducting wire is produced by removing, in a state where a copper foil to which rolling is applied at a draft of 90% or more is held at a temperature below a recrystallization temperature, an absorbed material on a surface of the copper foil by applying sputter etching to the surface of the copper foil; removing an absorbed material on a surface of a nonmagnetic metal sheet by applying sputter etching to the surface of the nonmagnetic metal sheet; bonding the copper foil and the metal sheet to each other by reduction rolls at an applied pressure of 300 MPa to 1500 MPa; orienting crystals of the copper by heating a laminated body obtained by bonding at a crystal orientation temperature of copper or above; and forming a protective layer on a copper-side surface of the laminated body by coating.