发明授权
- 专利标题: Curable composition
- 专利标题(中): 可固化组合物
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申请号: US12526751申请日: 2008-02-13
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公开(公告)号: US08815985B2公开(公告)日: 2014-08-26
- 发明人: Katsuyu Wakabayashi , Katsuya Ouchi
- 申请人: Katsuyu Wakabayashi , Katsuya Ouchi
- 申请人地址: JP Osaka
- 专利权人: Kaneka Corporation
- 当前专利权人: Kaneka Corporation
- 当前专利权人地址: JP Osaka
- 代理机构: Westerman, Hattori, Daniels & Adrian, LLP
- 优先权: JP2007-032074 20070213
- 国际申请: PCT/JP2008/052370 WO 20080213
- 国际公布: WO2008/099858 WO 20080821
- 主分类号: C08K5/34
- IPC分类号: C08K5/34 ; C08K5/16 ; C08K5/00 ; C08K5/24
摘要:
An object of the present invention is to provide a curable composition which is made mainly of a polymer having one or more reactive silicon groups, has good curability even when filler is used while a non-organotin catalyst is used, and is further high in industrial practicability. The object is solved by a curable composition, comprising, as constituents, a polymer (A) having one or more reactive silicon groups on average per molecule thereof, the reactive silicon group(s) being (each) a group which can be crosslinked by forming a siloxane bond, a Lewis acid and/or derivative thereof (B), an amine compound (C), a compound (D) having a reactive silicon group, and filler (E), and obtained by mixing the constituents with each other.
公开/授权文献
- US20100152373A1 CURABLE COMPOSITION 公开/授权日:2010-06-17