Invention Grant
- Patent Title: Signal amplifying circuit with reduced output signal noise by introducing coupling effect and related method thereof
- Patent Title (中): 信号放大电路通过引入耦合效应降低输出信号噪声及其相关方法
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Application No.: US13607830Application Date: 2012-09-10
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Publication No.: US08816771B2Publication Date: 2014-08-26
- Inventor: Hsien-Ku Chen , Chia-Jun Chang , Ka-Un Chan , Ying-Hsi Lin
- Applicant: Hsien-Ku Chen , Chia-Jun Chang , Ka-Un Chan , Ying-Hsi Lin
- Applicant Address: TW Science Park, HsinChu
- Assignee: Realtek Semiconductor Corp.
- Current Assignee: Realtek Semiconductor Corp.
- Current Assignee Address: TW Science Park, HsinChu
- Agent Winston Hsu; Scott Margo
- Priority: TW101118002A 20120521
- Main IPC: H03F3/45
- IPC: H03F3/45
Abstract:
A signal amplifying circuit includes: an input stage circuit, arranged to receive an input signal; a first inductive device coupled between the input stage circuit and a first reference voltage; an output stage circuit arranged to generate an output signal according to the input signal; and a second inductive device coupled between the output stage circuit and a second reference voltage, wherein at least a part of a winding of the first inductive element is cross-coupled to at least a part of a winding of the second inductive element.
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