Invention Grant
- Patent Title: Substrate processing method
- Patent Title (中): 基板加工方法
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Application No.: US13357893Application Date: 2012-01-25
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Publication No.: US08821737B2Publication Date: 2014-09-02
- Inventor: Tomohiro Jiromaru , Junichi Takeuchi
- Applicant: Tomohiro Jiromaru , Junichi Takeuchi
- Applicant Address: JP
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP2011-013751 20110126
- Main IPC: C03C15/00
- IPC: C03C15/00 ; B44C1/22
Abstract:
A processing method of a substrate which includes: a first bonding step which bonds a ring-shaped first support member to a first surface of the substrate along the outer periphery of the substrate; a first processing step which processes the substrate; and a first separating step which separates the first support member from the substrate by separation at the bonded position.
Public/Granted literature
- US20120187084A1 SUBSTRATE PROCESSING METHOD Public/Granted day:2012-07-26
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