Invention Grant
- Patent Title: Composite wafer including a molded wafer and a second wafer
- Patent Title (中): 复合晶片包括模制晶片和第二晶片
-
Application No.: US13459924Application Date: 2012-04-30
-
Publication No.: US08822275B2Publication Date: 2014-09-02
- Inventor: Michael Renne Ty Tan , Georgios Panotopoulos , Paul Kessler Rosenberg , Sagi Varghese Mathai , Wayne Victor Sorin , Susant K Patra
- Applicant: Michael Renne Ty Tan , Georgios Panotopoulos , Paul Kessler Rosenberg , Sagi Varghese Mathai , Wayne Victor Sorin , Susant K Patra
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agent Aaron Ward
- Main IPC: H01L21/78
- IPC: H01L21/78
Abstract:
A composite wafer includes a molded wafer and a second wafer. The molded wafer includes a plurality of first components, and the second wafer includes a plurality of second components. The second wafer is combined with the molded wafer to form the composite wafer. At least one of the first components is aligned with at least one of the second components to form a multi-component element. The multi-component element is singulatable from the composite wafer.
Public/Granted literature
- US20130286614A1 COMPOSITE WAFER INCLUDING A MOLDED WAFER AND A SECOND WAFER Public/Granted day:2013-10-31
Information query
IPC分类:
