Invention Grant
- Patent Title: Surface treatment methods and systems for substrate processing
- Patent Title (中): 表面处理方法和基板处理系统
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Application No.: US13722820Application Date: 2012-12-20
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Publication No.: US08822313B2Publication Date: 2014-09-02
- Inventor: Chi-I Lang , Sandip Niyogi
- Applicant: Intermolecular, Inc.
- Applicant Address: US CA San Jose
- Assignee: Intermolecular, Inc.
- Current Assignee: Intermolecular, Inc.
- Current Assignee Address: US CA San Jose
- Main IPC: H01L21/265
- IPC: H01L21/265 ; H01L21/365 ; H01L21/02
Abstract:
Embodiments provided herein describe methods and systems for processing substrates. A plasma including radical species and charged species is generated. The charged species of the plasma are collected. A substrate is exposed to the radical species of the plasma. A layer is formed on the substrate after exposing the substrate to the radical species.
Public/Granted literature
- US20140179113A1 Surface Treatment Methods and Systems for Substrate Processing Public/Granted day:2014-06-26
Information query
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