发明授权
US08822349B1 Oxide formation in a plasma process 有权
在等离子体工艺中形成氧化物

Oxide formation in a plasma process
摘要:
A method of making a semiconductor structure is provided. The method includes forming a dielectric layer using a high density plasma oxidation process. The dielectric layer is on a storage layer and the thickness of the storage layer is reduced during the high density plasma oxidation process.
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