Invention Grant
- Patent Title: Electron beam cured silicone release materials
- Patent Title (中): 电子束固化硅胶释放材料
-
Application No.: US13198266Application Date: 2011-10-13
-
Publication No.: US08822560B2Publication Date: 2014-09-02
- Inventor: Jayshree Seth , Timothy D. Filiatrault , Robin E. Wright , Panu K. Zoller , Zai-Ming Qiu
- Applicant: Jayshree Seth , Timothy D. Filiatrault , Robin E. Wright , Panu K. Zoller , Zai-Ming Qiu
- Applicant Address: US MN St. Paul
- Assignee: 3M Innovative Properties Company
- Current Assignee: 3M Innovative Properties Company
- Current Assignee Address: US MN St. Paul
- Agent Dena M. Ehrich
- Main IPC: C03C25/10
- IPC: C03C25/10 ; C08G18/67 ; C08F2/46 ; C08J3/28 ; C08G61/04 ; B05D3/06 ; B05D5/08 ; C09D183/06

Abstract:
Methods of electron beam curing nonfunctional polysiloxanes blended with functional polysiloxanes are provided. The resulting release materials are also provided.
Public/Granted literature
- US20130018145A1 ELECTRON BEAM CURED SILICONE RELEASE MATERIALS Public/Granted day:2013-01-17
Information query