发明授权
- 专利标题: Electron beam cured silicone release materials
- 专利标题(中): 电子束固化硅胶释放材料
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申请号: US13198266申请日: 2011-10-13
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公开(公告)号: US08822560B2公开(公告)日: 2014-09-02
- 发明人: Jayshree Seth , Timothy D. Filiatrault , Robin E. Wright , Panu K. Zoller , Zai-Ming Qiu
- 申请人: Jayshree Seth , Timothy D. Filiatrault , Robin E. Wright , Panu K. Zoller , Zai-Ming Qiu
- 申请人地址: US MN St. Paul
- 专利权人: 3M Innovative Properties Company
- 当前专利权人: 3M Innovative Properties Company
- 当前专利权人地址: US MN St. Paul
- 代理商 Dena M. Ehrich
- 主分类号: C03C25/10
- IPC分类号: C03C25/10 ; C08G18/67 ; C08F2/46 ; C08J3/28 ; C08G61/04 ; B05D3/06 ; B05D5/08 ; C09D183/06
摘要:
Methods of electron beam curing nonfunctional polysiloxanes blended with functional polysiloxanes are provided. The resulting release materials are also provided.
公开/授权文献
- US20130018145A1 ELECTRON BEAM CURED SILICONE RELEASE MATERIALS 公开/授权日:2013-01-17