Invention Grant
- Patent Title: Patterned conductive element
- Patent Title (中): 图形导电元件
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Application No.: US13339696Application Date: 2011-12-29
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Publication No.: US08822829B2Publication Date: 2014-09-02
- Inventor: Jia-Shyong Cheng , Po-Shan Huang , Po-Sheng Shih , Chun-Yi Hu , Chih-Han Chao , Jeah-Sheng Wu
- Applicant: Jia-Shyong Cheng , Po-Shan Huang , Po-Sheng Shih , Chun-Yi Hu , Chih-Han Chao , Jeah-Sheng Wu
- Applicant Address: TW Zhubei, Hsinchu County
- Assignee: Shih Hua Technology Ltd.
- Current Assignee: Shih Hua Technology Ltd.
- Current Assignee Address: TW Zhubei, Hsinchu County
- Agency: Novak Druce Connolly Bove + Quigg LLP
- Priority: TW100120200A 20110609
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/09 ; B82Y99/00

Abstract:
A patterned conductive element includes a substrate having a surface, an adhesive layer located on the surface, and a patterned carbon nanotube layer located on the adhesive layer. Part of the patterned carbon nanotube layer is embedded in the adhesive layer, and the other part of the patterned carbon nanotube layer is exposed from the adhesive layer.
Public/Granted literature
- US20120312587A1 PATTERNED CONDUCTIVE ELEMENT Public/Granted day:2012-12-13
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