Invention Grant
- Patent Title: Encapsulation architectures for utilizing flexible barrier films
- Patent Title (中): 利用柔性屏障膜的封装结构
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Application No.: US12800098Application Date: 2010-05-07
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Publication No.: US08823154B2Publication Date: 2014-09-02
- Inventor: Craig J. Hawker , Jimmy Granstrom , Luis M. Campos , Jeffrey A. Gerbec , Motoko Furukawa
- Applicant: Craig J. Hawker , Jimmy Granstrom , Luis M. Campos , Jeffrey A. Gerbec , Motoko Furukawa
- Applicant Address: US CA Santa Barbara
- Assignee: The Regents of The University of California
- Current Assignee: The Regents of The University of California
- Current Assignee Address: US CA Santa Barbara
- Agency: Gates & Cooper LLP
- Main IPC: H01L23/20
- IPC: H01L23/20

Abstract:
An article and method of using spacer layer regions is provided, containing a gas compound, to reduce gas permeation through barrier films overlying a substrate comprising creating a spacer layer between one or more of the barrier films, wherein the spacer layer comprises at least one inert gaseous compound. In another embodiment, an article and method is provided comprising creating alternating thin films of hybridized sol-gel spin-on glass and PDMS based and olefin based elastomers.
Public/Granted literature
- US20110062603A1 Encapsulation architectures for utilizing flexible barrier films Public/Granted day:2011-03-17
Information query
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