Invention Grant
- Patent Title: Frame assembly for installing panel modules with different dimensions and panel device therewith
- Patent Title (中): 用于安装不同尺寸的面板模块和面板装置的框架组件
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Application No.: US13444832Application Date: 2012-04-11
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Publication No.: US08824129B2Publication Date: 2014-09-02
- Inventor: Chih-Yi Wang , Ying-Chen Lin , Yu-Chi Chung
- Applicant: Chih-Yi Wang , Ying-Chen Lin , Yu-Chi Chung
- Applicant Address: TW Hsichih, New Taipei
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW Hsichih, New Taipei
- Agent Winston Hsu; Scott Margo
- Priority: TW100217420U 20110916
- Main IPC: G06F1/16
- IPC: G06F1/16 ; G02F1/1333

Abstract:
A frame assembly for installing panel modules with different dimensions is disclosed. The frame assembly includes a first frame and a second frame. The first frame has a first fixing structure formed thereon and a first sliding structure in an axis direction. The second frame has a second fixing structure formed thereon and a second sliding structure in the axis direction. The second sliding structure is slidably engaged with the first sliding structure. The first fixing structure and the second fixing structure are fixed on a side of a first panel module or on a side of a second panel module when the second frame slides relative to the first frame in the axis direction to a first position or to a second position.
Public/Granted literature
- US20130070407A1 FRAME ASSEMBLY FOR INSTALLING PANEL MODULES WITH DIFFERENT DIMENSIONS AND PANEL DEVICE THEREWITH Public/Granted day:2013-03-21
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