发明授权
- 专利标题: Two stage serial impingement cooling for isogrid structures
- 专利标题(中): 用于等网格结构的两级串联冲击冷却
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申请号: US13195947申请日: 2011-08-02
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公开(公告)号: US08826668B2公开(公告)日: 2014-09-09
- 发明人: Ching-Pang Lee , Jay A. Morrison
- 申请人: Ching-Pang Lee , Jay A. Morrison
- 申请人地址: US FL Orlando
- 专利权人: Siemens Energy, Inc.
- 当前专利权人: Siemens Energy, Inc.
- 当前专利权人地址: US FL Orlando
- 主分类号: H01L23/46
- IPC分类号: H01L23/46 ; F23R3/06 ; F01D9/02 ; F01D25/12 ; F01D5/18
摘要:
A system for cooling a wall (24) of a component having an outer surface with raised ribs (12) defining a structural pocket (10), including: an inner wall (26) within the structural pocket and separating the wall outer surface within the pocket into a first region (28) outside of the inner wall and a second region (40) enclosed by the inner wall; a plate (14) disposed atop the raised ribs and enclosing the structural pocket, the plate having a plate impingement hole (16) to direct cooling air onto an impingement cooled area (38) of the first region; a cap having a skirt (50) in contact with the inner wall, the cap having a cap impingement hole (20) configured to direct the cooling air onto an impingement cooled area (44) of the second region, and; a film cooling hole (22) formed through the wall in the second region.
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