发明授权
- 专利标题： Electroconductive layer, laminate using the same, and producing processes thereof
- 专利标题（中）： 导电层，使用其的叠层及其制造方法
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申请号： US12352048申请日： 2009-01-12
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公开(公告)号： US08828554B2公开(公告)日： 2014-09-09
- 发明人: Mutsuyuki Kawaguchi , Satoshi Saito , Tsuyoshi Amatani , Yuko Fujii
- 申请人： Mutsuyuki Kawaguchi , Satoshi Saito , Tsuyoshi Amatani , Yuko Fujii
- 申请人地址： JP Amagasaki-Shi
- 专利权人： Mec Company Ltd.
- 当前专利权人： Mec Company Ltd.
- 当前专利权人地址： JP Amagasaki-Shi
- 代理机构： Knobbe Martens Olson & Bear LLP
- 优先权： JP2008-022616 20080201; JP2008-257486 20081002
- 主分类号： B32B15/20
- IPC分类号： B32B15/20 ; H05K3/38
摘要：
The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 μm.
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