Invention Grant
- Patent Title: Process for assembling two parts of a circuit
- Patent Title (中): 组装电路两部分的工艺
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Application No.: US13222317Application Date: 2011-08-31
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Publication No.: US08828797B2Publication Date: 2014-09-09
- Inventor: Perceval Coudrain , Yacine Felk , Patrick Lamontagne
- Applicant: Perceval Coudrain , Yacine Felk , Patrick Lamontagne
- Applicant Address: FR Montrouge
- Assignee: STMicroelectronics SA
- Current Assignee: STMicroelectronics SA
- Current Assignee Address: FR Montrouge
- Agency: Gardere Wynne Sewell LLP
- Priority: FR1056942 20100901
- Main IPC: H01L21/77
- IPC: H01L21/77 ; H01L23/00 ; H01L25/065 ; H01L25/00
Abstract:
A three-dimensional integrated structure is fabricated by assembling at least two parts together, wherein each part contains at least one metallic line covered with a covering region and having a free side. A cavity is formed in the covering region of each part, that cavity opening onto the metallic line. The two parts are joined together with the free sides facing each other and the cavities in each covering region aligned with each other. The metallic lines are then electrically joined to each other through an electromigration of the metal within at least one of the metallic lines, the electromigrated material filling the aligned cavities.
Public/Granted literature
- US20120052629A1 PROCESS FOR ASSEMBLING TWO PARTS OF A CIRCUIT Public/Granted day:2012-03-01
Information query
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