发明授权
- 专利标题： Electronic device with heat dissipation apparatus
- 专利标题（中）： 带散热装置的电子设备
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申请号： US13554150申请日： 2012-07-20
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公开(公告)号： US08830681B2公开(公告)日： 2014-09-09
- 发明人: Lei Liu
- 申请人： Lei Liu
- 申请人地址： CN Shenzhen TW New Taipei
- 专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人： Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- 当前专利权人地址： CN Shenzhen TW New Taipei
- 代理机构： Novak Druce Connolly Bove + Quigg LLP
- 优先权： CN201210202725 20120619
- 主分类号： H05K7/20
- IPC分类号： H05K7/20 ; F28F9/00
摘要：
A heat dissipation apparatus for an electronic component installed in an enclosure of an electronic device includes a bracket and a heat sink. The bracket includes a supporting plate, an elastic positioning plate extending slantingly up from a side of the supporting plate away from the electronic component, and an installation plate extending from the positioning plate to be attached to the enclosure. The heat sink is fixed to the supporting plate to abut against the electronic component.
公开/授权文献
- US20130335922A1 ELECTRONIC DEVICE WITH HEAT DISSIPATION APPARATUS 公开/授权日：2013-12-19
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