发明授权
- 专利标题： Seal structure for electronic equipment
- 专利标题（中）： 电子设备密封结构
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申请号： US13059595申请日： 2009-08-06
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公开(公告)号： US08833772B2公开(公告)日： 2014-09-16
- 发明人: Takashi Sasaki , Tomoko Nakano , Naohiro Fujisawa , Keiichi Miyajima
- 申请人： Takashi Sasaki , Tomoko Nakano , Naohiro Fujisawa , Keiichi Miyajima
- 申请人地址： JP
- 专利权人： Nippon Mektron, Ltd.
- 当前专利权人： Nippon Mektron, Ltd.
- 当前专利权人地址： JP
- 代理机构： Harness, Dickey & Pierce, P.L.C.
- 优先权： JP2008-217678 20080827; JP2009-071689 20090324
- 国际申请： PCT/JP2009/063912 WO 20090806
- 国际公布： WO2010/024097 WO 20100304
- 主分类号： F16J15/02
- IPC分类号： F16J15/02 ; H05K5/06 ; F16J15/10
摘要：
In order to enhance a shape retaining property of a gasket consisting only of a rubber, prevent damage to a casing for an electronic equipment due to high reactive force of the gasket, and make assembling of the casing easy, a seal structure comprises a gasket installed in a non-adhesion manner between a case and a lid to be interposed in a compressed state when the case and the lid are assembled, and a resin film integrated with the gasket to enhance the shape retaining property of the gasket, the gasket has a portion compressed between the case and the lid when they are assembled, and a portion not compressed between them when assembled and the resin film is integrated with the portion which is not compressed.
公开/授权文献
- US20110140375A1 SEAL STRUCTURE FOR ELECTRONIC EQUIPMENT 公开/授权日：2011-06-16
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