Invention Grant
US08835255B2 Method of forming a semiconductor structure including a vertical nanowire
有权
形成包括垂直纳米线的半导体结构的方法
- Patent Title: Method of forming a semiconductor structure including a vertical nanowire
- Patent Title (中): 形成包括垂直纳米线的半导体结构的方法
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Application No.: US13747907Application Date: 2013-01-23
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Publication No.: US08835255B2Publication Date: 2014-09-16
- Inventor: Tim Baldauf , Stefan Flachowsky , Tom Hermann , Ralf Illgen
- Applicant: Globalfoundries Inc.
- Applicant Address: KY Grand Cayman
- Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee: GLOBALFOUNDRIES Inc.
- Current Assignee Address: KY Grand Cayman
- Agency: Amerson Law Firm, PLLC
- Main IPC: H01L21/336
- IPC: H01L21/336

Abstract:
A method comprises providing a semiconductor structure comprising a substrate and a nanowire above the substrate. The nanowire comprises a first semiconductor material and extends in a vertical direction of the substrate. A material layer is formed above the substrate. The material layer annularly encloses the nanowire. A first part of the nanowire is selectively removed relative to the material layer. A second part of the nanowire is not removed. A distal end of the second part of the nanowire distal from the substrate is closer to the substrate than a surface of the material layer so that the semiconductor structure has a recess at the location of the nanowire. The distal end of the nanowire is exposed at the bottom of the recess. The recess is filled with a second semiconductor material. The second semiconductor material is differently doped than the first semiconductor material.
Public/Granted literature
- US20140206157A1 METHOD OF FORMING A SEMICONDUCTOR STRUCTURE INCLUDING A VERTICAL NANOWIRE Public/Granted day:2014-07-24
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