Invention Grant
- Patent Title: Light emitting device package and lighting system
- Patent Title (中): 发光装置封装和照明系统
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Application No.: US14013882Application Date: 2013-08-29
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Publication No.: US08835969B2Publication Date: 2014-09-16
- Inventor: Ji Won Jang
- Applicant: LG Innotek Co., Ltd
- Applicant Address: KR Seoul
- Assignee: LG Innotek Co., Ltd.
- Current Assignee: LG Innotek Co., Ltd.
- Current Assignee Address: KR Seoul
- Agency: KED & Associates LLP
- Priority: KR10-2009-0111034 20091117
- Main IPC: H01L33/58
- IPC: H01L33/58

Abstract:
Disclosed are a light emitting device package and a lighting system. The light emitting device package includes a body including a cavity and formed in a transmittive material; a plurality of lead electrodes in the cavity; an isolation member disposed between the lead electrodes; a light emitting device electrically connected to the lead electrodes in the cavity; and a molding member on the light emitting device.
Public/Granted literature
- US20140008687A1 LIGHT EMITTING DEVICE PACKAGE AND LIGHTING SYSTEM Public/Granted day:2014-01-09
Information query
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