发明授权
- 专利标题: Surface mount piezoelectric oscillator
- 专利标题(中): 表面贴装压电振荡器
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申请号: US13726206申请日: 2012-12-23
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公开(公告)号: US08836441B2公开(公告)日: 2014-09-16
- 发明人: Hidenori Harima
- 申请人: Nihon Dempa Kogyo Co., Ltd.
- 申请人地址: JP Tokyo
- 专利权人: Nihon Dempa Kogyo Co., Ltd.
- 当前专利权人: Nihon Dempa Kogyo Co., Ltd.
- 当前专利权人地址: JP Tokyo
- 代理机构: Jianq Chyun IP Office
- 优先权: JP2011-285402 20111227; JP2012-229794 20121017
- 主分类号: H03B5/32
- IPC分类号: H03B5/32 ; H01L41/053 ; H03H9/05 ; H03H9/10
摘要:
A surface mount piezoelectric oscillator includes a piezoelectric resonator with a container main body, a plurality of external terminals, a mounting board with an IC chip, a plurality of connecting terminals, and a solder ball. The solder ball bonds the plurality of external terminals and the plurality of connecting terminals by melting and hardening. The solder bonding portion has approximately a circular shape with approximately a same size as a size of the connecting terminal of the mounting board. The solder ball placed on the connecting terminal of the mounting board is melted, self-aligned, and hardened so as to form a solder fillet of nearly axial symmetry. The solder fillet bridges between the both electrodes and bonds the connecting terminal of the mounting board and the solder bonding portion of the external terminal of the piezoelectric resonator.
公开/授权文献
- US20130162362A1 SURFACE MOUNT PIEZOELECTRIC OSCILLATOR 公开/授权日:2013-06-27
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