发明授权
- 专利标题: Multilayer ceramic electronic component and method of fabricating the same
- 专利标题(中): 多层陶瓷电子元件及其制造方法
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申请号: US13620635申请日: 2012-09-14
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公开(公告)号: US08837112B2公开(公告)日: 2014-09-16
- 发明人: Hyun Hee Gu , Myung Jun Park , Kyu Ha Lee , Da Young Choi , Jae Young Park , Sang Hoon Kwon , Byung Jun Jeon
- 申请人: Hyun Hee Gu , Myung Jun Park , Kyu Ha Lee , Da Young Choi , Jae Young Park , Sang Hoon Kwon , Byung Jun Jeon
- 申请人地址: KR Suwon, Gyunggi-Do
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon, Gyunggi-Do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2012-0070184 20120628
- 主分类号: H01G4/06
- IPC分类号: H01G4/06 ; H01G4/30 ; H01G4/005
摘要:
There is provided a multilayer ceramic electronic component, including: a ceramic body including a dielectric layer; a plurality of internal electrodes disposed to face each other within the ceramic body, having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the ceramic body includes an active layer corresponding to a capacitance forming part and a cover layer formed on at least one of an upper surface and a lower surface of the active layer and corresponding to a non-capacitance forming part, an average thickness of the cover layer is 15 μm or less, the external electrodes include a conductive metal and a glass, and when an area of the external electrodes occupied by the glass is A and an area thereof occupied by the conductive metal is B, 0.05≦A/B≦0.6 is satisfied.