Invention Grant
- Patent Title: Production method of electronic component
- Patent Title (中): 电子元件的生产方法
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Application No.: US13565150Application Date: 2012-08-02
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Publication No.: US08839502B2Publication Date: 2014-09-23
- Inventor: Tsuyoshi Yokoyama , Kazunori Inoue , Kazuhiro Matsumoto
- Applicant: Tsuyoshi Yokoyama , Kazunori Inoue , Kazuhiro Matsumoto
- Applicant Address: JP Tokyo
- Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee: Taiyo Yuden Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Chen Yoshimura LLP
- Priority: JP2010-031726 20100216
- Main IPC: H04R31/00
- IPC: H04R31/00 ; H03H9/05 ; H03H9/10
Abstract:
A production method of an electronic component includes: forming a sheet having a resin layer and a metal layer formed under the resin layer; bonding the sheet to a substrate so that the metal layer is arranged on a functional portion of an acoustic wave element formed on the substrate, a frame portion surrounding the functional portion is formed between the metal layer and the substrate, a cavity is formed on the functional portion by the metal layer and the frame portion, and the resin layer covers the metal layer and the frame portion.
Public/Granted literature
- US20120299665A1 ELECTRONIC COMPONENT AND PRODUCTION METHOD THEREOF Public/Granted day:2012-11-29
Information query
