发明授权
- 专利标题: Inner garnish assembly module system
- 专利标题(中): 内装装配模块系统
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申请号: US12666305申请日: 2008-06-30
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公开(公告)号: US08840170B2公开(公告)日: 2014-09-23
- 发明人: John Zimmer , Rod Bara
- 申请人: John Zimmer , Rod Bara
- 申请人地址: US MI Novi
- 专利权人: Cooper-Standard Automotive Inc.
- 当前专利权人: Cooper-Standard Automotive Inc.
- 当前专利权人地址: US MI Novi
- 代理机构: Fay Sharpe LLP
- 国际申请: PCT/US2008/068823 WO 20080630
- 国际公布: WO2009/006425 WO 20090108
- 主分类号: B60J10/08
- IPC分类号: B60J10/08 ; B60J10/00 ; B60R13/02
摘要:
A one-piece inner garnish assembly module system (MS) joins an inner garnish molding (IG), primary seal (PS), glass run (GR), and inner beltline weatherstrip (IB) into a single component prior to installation of the module system on a vehicle. The garnish is secured to the glass run along the A and B pillars, and the interconnecting header portion of a vehicle door. In addition, the primary seal is operatively associated or secured to the garnish, and may be pin-mounted to the door, or mechanically connected, and/or adhesively secured to the door.
公开/授权文献
- US20120091746A1 INNER GARNISH ASSEMBLY MODULE SYSTEM 公开/授权日:2012-04-19
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