Invention Grant
- Patent Title: Injection molding apparatus having a plate heater and having a cooling passage or an insulation space
- Patent Title (中): 具有板式加热器并具有冷却通道或绝缘空间的注塑设备
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Application No.: US13475398Application Date: 2012-05-18
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Publication No.: US08840394B2Publication Date: 2014-09-23
- Inventor: Jin Soo Pyo , Jong Won Lee , Jin Hyun Cho , Jin Sub Kim
- Applicant: Jin Soo Pyo , Jong Won Lee , Jin Hyun Cho , Jin Sub Kim
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2011-0047975 20110520
- Main IPC: B29C45/73
- IPC: B29C45/73
Abstract:
An injection molding apparatus is provided. The injection molding apparatus includes a mold, a plate heater mounted to the mold to heat the mold, and a cooling passage provided above or below the plate heater.
Public/Granted literature
- US20120294976A1 INJECTION MOLDING APPARATUS Public/Granted day:2012-11-22
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