发明授权
- 专利标题: Optoelectronic semiconductor chip
- 专利标题(中): 光电半导体芯片
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申请号: US13056589申请日: 2009-06-29
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公开(公告)号: US08841685B2公开(公告)日: 2014-09-23
- 发明人: Lutz Hoeppel , Matthias Sabathil
- 申请人: Lutz Hoeppel , Matthias Sabathil
- 申请人地址: DE Regensburg
- 专利权人: OSRAM Opto Semiconductors GmbH
- 当前专利权人: OSRAM Opto Semiconductors GmbH
- 当前专利权人地址: DE Regensburg
- 代理机构: Cozen O'Connor
- 优先权: DE102008035110 20080728
- 国际申请: PCT/DE2009/000917 WO 20090629
- 国际公布: WO2010/012256 WO 20100204
- 主分类号: H01L33/00
- IPC分类号: H01L33/00 ; H01L33/38 ; H01L33/42 ; H01L33/40
摘要:
A description is given of an optoelectronic semiconductor chip (1) comprising a semiconductor layer sequence (2), which has an active zone (4) for generating electromagnetic radiation, and comprising a structured current spreading layer (6), which contains a transparent conductive oxide and is arranged on a main area (12) of the semiconductor layer sequence (2), wherein the current spreading layer (6) covers at least 30% and at most 60% of the main area (12).
公开/授权文献
- US20110284893A1 Optoelectronic Semiconductor Chip 公开/授权日:2011-11-24
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