发明授权
US08841750B2 Local wiring for a bipolar junction transistor including a self-aligned emitter region
有权
包括自对准发射极区域的双极结型晶体管的局部布线
- 专利标题: Local wiring for a bipolar junction transistor including a self-aligned emitter region
- 专利标题(中): 包括自对准发射极区域的双极结型晶体管的局部布线
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申请号: US13551971申请日: 2012-07-18
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公开(公告)号: US08841750B2公开(公告)日: 2014-09-23
- 发明人: David L. Harame , Zhong-Xiang He , Qizhi Liu
- 申请人: David L. Harame , Zhong-Xiang He , Qizhi Liu
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 代理机构: Hoffman Warnick LLC
- 代理商 Michael J. LeStrange
- 主分类号: H01L29/732
- IPC分类号: H01L29/732 ; H01L29/66 ; H01L29/73 ; H01L29/08
摘要:
Aspects of the invention provide for a bipolar transistor of a self-aligned emitter. In one embodiment, the invention provides a method of forming local wiring for a bipolar transistor with a self-aligned sacrificial emitter, including: performing an etch to remove the sacrificial emitter to form an emitter opening between two nitride spacers; depositing an in-situ doped emitter into the emitter opening; performing a recess etch to partially remove a portion of the in-situ doped emitter; depositing a silicon dioxide layer over the recessed in-situ doped emitter; planarizing the silicon dioxide layer via chemical mechanical polishing; etching an emitter trench over the recessed in-situ doped emitter; and depositing tungsten and forming a tungsten wiring within the emitter trench via chemical mechanical polishing.
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