A server rack heat dissipation system for a server including an electronic component comprises a first and a second heat dissipation assembly. The first heat dissipation assembly includes a first heat exchanger and a first pipeline. The first heat exchanger is inside the server rack and in thermal contact with the electronic component. The first pipeline is in thermal contact with the first heat exchanger and has a first coolant. The second heat dissipation assembly includes a second heat exchanger. The second heat exchanger is inside the server rack and in thermal contact with the first pipeline. The second heat exchanger can remove the heat of the electronic component in the first coolant in advance. Accordingly, the time of the first coolant being maintained in a vapor phase can be shortened, so that a power the fluid driving device used for driving the first coolant is reduced.